Wafer Robotics
PRE-350B-INT-CE-S2
Brooks Automation / PRI Atmospheric Wafer Pre-Aligner
About this part
PRE-350B-INT-CE-S2 is a configured Brooks Automation / PRI atmospheric wafer pre-aligner in the PRE-350 family. The manufacturer’s PRE-350 documentation defines a single-axis, chuck-loading architecture for 200 mm and 300 mm wafers, with optional 150 mm handling. The aligner rotates the wafer about the theta axis while the associated robot supplies radial and vertical motion for centering. Technical values below are identified as PRE-350-family data where the manufacturer did not publish an exact configured-unit specification
Configurations vary. Verify the exact unit before choosing a replacement.
Key Facts
Specifications
| Configured model | PRE-350B-INT-CE-S2 |
| Product family | PRE-350 atmospheric wafer pre-aligner |
| Primary function | Determines wafer center and fiducial orientation, then positions the wafer for handling |
| Motion axes | One axis: theta rotation |
| Centering architecture | The pre-aligner rotates the wafer; the robot supplies radial and vertical motion for centering |
| Supported wafer sizes | 200 mm and 300 mm; 150 mm optional |
| Load type | Chuck loading |
| Associated end-effector style | Horseshoe |
| Edge sensing | CCD sensor and LED illumination arrays detect the wafer edge and flat or notch |
| CCD pixel resolution | 10.7 µm |
| Compatible controller families | Brooks Smart Controller (ESC) or Dual Controller (EDC), selected according to system-axis requirements |
| Single-axis drive arrangement | One AMC driver unit rather than the three-axis pre-aligner amplifier board |
| Power architecture | The pre-aligner receives operating power from its Brooks Automation controller |
| Pre-aligner cable connections | Eight-pin motor-power connector, 50-pin motor-signal connector, and separate CCD-data connection |
| External vacuum supply | −20 to −25 inHg recommended; the manual lists pressure magnitudes of 67,728 to 84,660 Pa |
| Vacuum hose fitting | Accommodates 1/8-inch OD hose unless customized |
| Operating temperature | 15 to 32.5 °C (59 to 89 °F) |
| Storage temperature | −25 to 55 °C (−13 to 131 °F); up to 65 °C (149 °F) for 24 hours |
| Relative humidity | 10% to 80%, non-condensing |
| Nominal input ratings | 100/120 VAC at 5 A or 220/240 VAC at 2.5 A |
| Permitted voltage and frequency | 92 to 260 VAC, 47 to 63 Hz; these are controller input specifications, not a direct aligner AC input |
Configuration-code boundary
The full configured identifier must be retained intact; the available manufacturer family manual does not publish a decoding table for its B, INT, CE, or S2 elements.
System roles and compatibility
The PRE-350 operates as one component of a coordinated wafer-handling system.
| Component | Documented role | Relationship to PRE-350 |
|---|---|---|
| PRE-350 pre-aligner | Theta rotation, optical edge acquisition, and flat/notch orientation | Single-axis chuck-loading aligner |
| Atmospheric robot | Radial and vertical wafer motion | Supplies the two centering motions not present in the single-axis aligner |
| ESC or EDC controller | Motion control, wafer-edge processing, macros, and alignment status | Required controller architecture; exact controller model depends on the complete system |
| Host PC or teach pendant | Operator and host command interface | Communicates through the controller rather than directly defining the aligner hardware configuration |
Installation and service notes
- Mount the pre-aligner on a baseplate at least 0.500 inch thick when aluminum or at least 0.375 inch thick when stainless steel, and bolt it to the system.
- The pre-aligner does not provide an Emergency Off device; the system integrator is responsible for the EMO circuit.
- Moving mechanisms can operate automatically whenever power is applied. Covers, connector locks, grounding, and facility lockout/tagout procedures are required.
- The external vacuum source must not create internal pressure above normal atmosphere; the unit has no overpressure protection.
- Manufacturer calibration data is stored in wafer-calibration files. A complete system alignment is required for initial installation and after aligner replacement or a wafer-transfer error.
- Routine maintenance is principally cleaning as required. The manufacturer states that the pre-aligner has no user-serviceable parts and requires de-energization before cleaning.
Documentation Downloads
Local PDF copiesPart Photos
5 imagesHistorical archive images for identification, labels, connectors, and condition reference, not current inventory.
Historical Listings & Prices
Historical listing data, not a current offerThe typical recorded price range is $5,199.92 to $13,199.92. Based on 3 archived listing records; not a current offer, appraisal, or confirmed sale price.
View archived listing titles
- BROOKS AUTOMATION PRE-350B-INT-CE-S2 WAFER PREALIGNER
- Brooks Automation/PRI WAFER Aligner PRE-350B-INT-CE-S2 P/N 6-0002-1583-SP
